Informazioni sul documento
- Università
- Politecnico di Milano
- Corso di laurea
- Aerospace Engineering
- Materia
- Heat Transfer and Thermal Analysis
- Classificazione
- Esame · Esame completo
- Contenuto
- Testo d’esame
- Formato originale
- Testo
- Testo ricercabile
Esame completo di Heat Transfer and Thermal Analysis per il corso di Aerospace Engineering presso Politecnico di Milano. Materiale proveniente dall’archivio storico Studwiz e classificato per la consultazione online.
Esame completo di Heat Transfer and Thermal Analysis per il corso di Aerospace Engineering presso Politecnico di Milano. Materiale proveniente dall’archivio storico Studwiz e classificato per la consultazione online.
Qualità dell’importazione: il testo è stato estratto direttamente dal documento originale.
Passaggi rappresentativi riconosciuti nelle diverse parti del materiale. Il testo completo resta presente nella pagina per la ricerca, mentre l’anteprima compatta rende più semplice la lettura.
Heat Transfer and Thermal Analysis - A.A. 2013/14 - Date 2015/02/11 Surname: Name: ID number: Signature: Part B (sufficient if ≥ 16) Exercise 1 (up to 8 points) A microprocessor has the shape of a thin parallelepiped, with base 30x30 mm and height 3 mm, and its lower base is glued to a plate which can be assumed as adiabatic. Its equivalent thermophysical properties are density ρ = 3500 kg/m 3, heat capacity c = 200 J/kgK, conductivity λ = 50 W/mK, and during average operation its surface temperature is 45 ◦C. 1. When the computer is switched off, the microprocessor is immersed in stagnant air (properties given in the table on the side of sketch of ex. 3) at atmospheric pressure and T∞ = 25◦C. Neglecting radiation and explaining the other assumptions you decide to make, determine the time required for the microprocessor to cool down to 1 K over the air temperature. 2. When the computer is switched on, the microprocessor starts receiving ˙WE of electric power (constant in time), which is dissipated by Joule effect. Write the differential equation to be solved to determine the temperature profile with time T (τ). For both cases, the effect of the sides of the parallelepiped can be neglected. Exercise 2 (up to 11 points) A hollow sphere, whose external diameter is Ds = 100 mm, is made by two layers, having thickness and conductivity s1 = 10 mm, λ1 = 0.5 W/mK, s2 = 20 mm, λ2 = 1 W/mK respectively. In the internal layer 1, a uniform heat source ˙U ′′′ = 106 W/m3 is present. The external surface of the sphere can be assumed as gray with emissivity εs = 0.75. Knowing that the system is in steady-state conditions, that convection outside the sphere is negligible and that the temperature of the interface between the two solid layers is T12 = 875◦C: 1. calculate how much radiative heat…
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